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d a t a sh eet product speci?cation supersedes data of 2000 jan 31 file under integrated circuits, ic19 2000 feb 22 integrated circuits tza3001ahl; tza3001bhl; tza3001u sdh/sonet stm4/oc12 laser drivers
2000 feb 22 2 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u features 622 mbits/s data input, both current mode logic (cml) and positive emitter coupled logic (pecl) compatible; maximum 800 mv (p-p) adaptive laser output control with dual loop, stabilizing optical 1 and 0 levels optional external control of laser modulation and biasing currents (non-adaptive) automatic laser shutdown few external components required rise and fall times of 120 ps (typical value) jitter <50 mui (p-p) rf output current sinking capability of 60 ma bias current sinking capability of 90 ma power dissipation of 430 mw (typical value) low cost lqfp32 5 5 plastic package single 5 v power supply. tza3001ahl laser alarm output for signalling extremely low and high bias current conditions. tza3001bhl extra stm4 622 mbits/s loop mode input; both cml and pecl compatible. tza3001u bare die version with combined bias alarm and loop mode functionality. applications sdh/sonet stm4/oc12 optical transmission systems sdh/sonet stm4/oc12 optical laser modules. general description the tza3001ahl, tza3001bhl and tza3001u are fully integrated laser drivers for stm4/oc12 (622 mbits/s) systems, incorporating the rf path between the data multiplexer and the laser diode. since the dual loop bias and modulation control circuits are integrated on the ic, the external component count is low. only decoupling capacitors and adjustment resistors are required. the tza3001ahl features an alarm function for signalling extreme bias current conditions. the alarm low and high threshold levels can be adjusted to suit the application using only a resistor or a current digital-to-analog converter (dac). the tza3001bhl is provided with an additional rf data input to allow remote system testing (loop mode). the tza3001u is a bare die version for use in compact laser module designs. the die contains 40 pads and features the combined functionality of the tza3001ahl and the tza3001bhl. ordering information type number package name description version tza3001ahl lqfp32 plastic low pro?le quad ?at package; 32 leads; body 5 5 1.4 mm sot401-1 tza3001bhl tza3001u - bare die; 2000 2000 380 m m -
2000 feb 22 3 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u block diagram handbook, full pagewidth laser control block band gap reference data input (differential) tza3001ahl current switch alarmhi tzero 2 din monin 28 18 alarmlo 21 5 tone 4 alarm 26 22 one 23 zero 13 la dinq 29 12 laq 15 bias 6 bgap mgk271 als 31 v cc(b) 10 gnd 1, 3, 8, 9, 11, 14, 16, 17 24, 25, 32 v cc(g) 7 v cc(r) 19, 20 27, 30 411 fig.1 block diagram of tza3001ahl. handbook, full pagewidth mgk270 laser control block band gap reference tza3001bhl current switch mux tzero als 2 dloop monin 19 31 v cc(b) 10 gnd 1, 3, 8, 9, 11, 14, 16, 17 24, 25, 32 v cc(g) 7 enl 26 5 tone 4 22 one 23 zero 13 la dloopq 20 din 28 dinq 29 12 laq 15 bias 6 bgap v cc(r) 18, 21 27, 30 411 fig.2 block diagram of tza3001bhl.
2000 feb 22 4 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u pinning symbol pin pad description tza3001ahl tza3001bhl tza3001u gnd 1 1 1 ground monin 2 2 2 monitor photodiode current input gnd 3 3 3 ground igm -- 4 not connected tone 4 4 5 connection for external capacitor used for setting optical 1 control loop time constant (optional) tzero 5 5 6 connection for external capacitor used for setting optical 0 control loop time constant (optional) bgap 6 6 7 connection for external band gap decoupling capacitor v cc(g) 7 7 8 supply voltage (green domain); note 1 v cc(g) -- 9 supply voltage (green domain); note 1 gnd 8 8 10 ground gnd 9 9 11 ground v cc(b) 10 10 12 supply voltage (blue domain); note 2 v cc(b) -- 13 supply voltage (blue domain); note 2 gnd 11 11 14 ground laq 12 12 15 laser modulation output inverted la 13 13 16 laser modulation output gnd 14 14 17 ground bias 15 15 18 laser bias current output gnd 16 16 19 ground gnd 17 17 20 ground gnd -- 21 ground alarmhi 18 - 22 maximum bias current alarm reference level input v cc(r) - 18 23 supply voltage (red domain); note 3 v cc(r) 19 -- supply voltage (red domain); note 3 dloop - 19 24 loop mode data input v cc(r) 20 -- supply voltage (red domain); note 3 dloopq - 20 25 loop mode data input inverted v cc(r) -- 26 supply voltage (red domain); note 3 alarmlo 21 - 27 minimum bias current alarm reference level input v cc(r) - 21 - supply voltage (red domain); note 3 one 22 22 28 optical 1 reference level input zero 23 23 29 optical 0 reference level input gnd 24 24 30 ground gnd 25 25 31 ground alarm 26 - 32 alarm output enl - 26 33 loop mode enable input v cc(r) 27 27 34 supply voltage (red domain); note 3
2000 feb 22 5 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u notes 1. supply voltage for the monitor photodiode (mpd) input current. 2. supply voltage for the laser modulation outputs (la, laq). 3. supply voltage for the data inputs (din, dinq), optical 1 and 0 reference level inputs (one, zero), and the bias current alarm reference level inputs (alarmhi, alarmlo). din 28 28 35 data input dinq 29 29 36 data input inverted v cc(r) 30 30 37 supply voltage (red domain); note 3 als 31 31 38 automatic laser shutdown input gnd 32 32 39 ground gnd -- 40 ground symbol pin pad description tza3001ahl tza3001bhl tza3001u handbook, full pagewidth tza3001ahl mgk273 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 gnd monin gnd tone tzero bgap v cc(g) gnd gnd v cc(b) gnd laq gnd bias gnd la gnd alarmhi v cc(r) one alarmlo zero v cc(r) gnd gnd din dinq v cc(r) als gnd alarm v cc(r) fig.3 pin configuration of tza3001ahl.
2000 feb 22 6 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth tza3001bhl mgk272 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 gnd monin gnd tone tzero bgap v cc(g) gnd gnd v cc(b) gnd laq gnd bias gnd la gnd v cc(r) dloopq one v cc(r) zero dloop gnd gnd din dinq v cc(r) als gnd enl v cc(r) fig.4 pin configuration of tza3001bhl. functional description the tza3001ahl, tza3001bhl and tza3001u laser drivers accept a 622 mbits/s stm4 non-return to zero (nrz) input data stream, and generate an output signal with sufficient current to drive a solid state fabry perot (fp) or distributed feedback (dfb) laser. they also contain dual loop control circuitry for stabilizing the true laser optical power levels representing logic 1 and logic 0. the input buffers present a high impedance to the data stream on the differential inputs (pins din and dinq); see fig.5. the input signal can be at a cml level of approximately 200 mv (p-p) below the supply voltage, or at a pecl level up to 800 mv (p-p). the inputs can be configured to accept cml signals by connecting pins din and dinq to v cc(r) via external 50 w pull-up resistors. if pecl compatibility is required, the usual thevenin termination can be applied. handbook, full pagewidth mgs910 10 k w 10 k w dinq, dloopq din, dloop 100 w gnd v cc(r) 100 w fig.5 din/dinq and dloop/dloopq inputs.
2000 feb 22 7 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u for ecl signals (negative and referenced to ground), the inputs should be ac-coupled to the signal source. if ac-coupling is applied, a constant input signal (either low or high) will cause the device to be in an undefined state. to avoid this, it is recommended to apply a slight offset to the input stage. the applied offset must be higher than the specified value in chapter characteristics, but much lower than the applied input voltage swing. the rf path is fully differential and contains a differential preamplifier and a main amplifier. the main amplifier is able to operate at the large peak currents required at the output laser driver stage and is insensitive to supply voltage variations. the output signal from the main amplifier drives a current switch which supplies a guaranteed maximum modulation current of 60 ma to pins la and laq (see fig.6). the bias pin outputs a guaranteed maximum dc bias current of up to 90 ma for adjusting the optical laser output to a level above its light emitting threshold (see fig.7). automatic laser control a laser with a monitor photodiode (mpd) is required for the laser control circuit (see application diagrams figs 18 and 19). the mpd current is proportional to the laser emission and is applied to pin monin. the mpd current range is 100 to 1000 m a (p-p). the input buffer is optimized to cope with an mpd capacitance of up to 50 pf. to prevent the input buffer from oscillating if the mpd capacitance is low, the capacitance should be increased to the minimum value specified in chapter characteristics, by connecting a capacitor between pin monin and v cc(g) . dc reference currents are applied to pins one and zero to set the mpd reference levels for laser high and laser low respectively. this is adequately achieved by using resistors to connect v cc(r) to pins one and zero, (see fig.8), however, current dacs can also be used. the voltages on pins one and zero are held at a constant level of 1.5 v below v cc(r) . the reference current applied to pin one is internally multiplied by 16 and the reference current flowing into pin zero is internally multiplied by 4. the accuracy of the v cc(r) - 1.5 v voltage at pins one and zero is described in section accuracy of voltage on inputs: one, zero, alarmlo, alarmhi. handbook, halfpage mgs906 gnd la laq als tr tr n fig.6 la and laq outputs. handbook, halfpage mgs907 gnd bias als tr tr n fig.7 laser driver bias current output circuit. handbook, halfpage mgs908 v cc(r) gnd one, zero, alarmlo, alarmhi 50 m a 30 k w fig.8 one, zero, alarmlo and alarmhi inputs.
2000 feb 22 8 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u the reference current and the resistor for the optical 1 modulation current control loop is calculated using the following formulae: (1) (2) the reference current and resistor for the optical 0 bias current control loop is calculated using the following formulae: (3) (4) in these formulae, i mpd(one) and i mpd(zero) represent the mpd current during an optical 1 and an optical 0 period, respectively. e xample a laser operates at optical output power levels of 0.3 mw for laser high and 0.03 mw for laser low (extinction ratio of 10 db). suppose the corresponding mpd currents for this particular laser are 260 and 30 m a, respectively. in this example, the reference current flowing into pin one is: this current can be set using a current source or simply by a resistor of the appropriate value connected between pin one and v cc(r) . in this example, the resistor is: in this example, the reference current at pin zero is: and can be set using a resistor: it should be noted that the mpd current is stabilized rather than the actual laser optical output power. any deviations between optical output power and mpd current, known as tracking errors, cannot be corrected. designing the modulation and bias current control loop the optical 1 and 0 current control loop time constants are determined by on-chip capacitances. if the resulting time constants are found to be too small in a specific application, they can be increased by connecting a capacitor between pins tzero and tone. the optical 1 modulation current control loop time constant ( t ) and bandwidth (b) can be estimated using the following formulae: (5) (6) the optical 0 bias current control loop time constant and bandwidth can be estimated using the following formulae: (7) (8) the term h laser (dimensionless) in the above formulae is the product of the following two terms: h eo is the electro-optical efficiency which accounts for the steepness of the laser slope characteristic. it defines the rate at which the optical output power increases with modulation current, and is measured in w/a. r is the mpd responsivity. it determines the amount of mpd current for a given value of optical output power, and is measured in a/w. e xample a laser with an mpd has the following specifications: p o = 1 mw, i th = 25 ma, h eo = 30 mw/a, r = 500 ma/w. the term i th is the required threshold current to switch on the laser. if the laser operates just above the threshold level, it may be assumed that h eo near the optical 0 level is 50% of h eo near the optical 1 level, due to the slope decreasing near the threshold level. i ref one () 1 16 ------ i mpd(one) = a [] r one 1.5 i one ----------- 24 i mpd(one) ------------------------ == w [] i ref zero () 1 4 -- - i mpd(zero) = a [] r zero 1.5 i zero ------------- - 6 i mpd(zero) -------------------------- - == w [] i ref one () 1 16 ------ 260 10 6 C 16.25 m a == r one 1.5 16.25 10 6 C -------------------------------- - 92.3 k w == i ref zero () 1 4 -- - 30 10 6 C 7.5 m a == r zero 1.5 7.5 10 6 C ------------------------- - 200 k w == t one 40 10 12 C c tone + () 80 10 3 h laser --------------------- - = s [] b one 1 2 pt one ------------------------- - = hz [] b one h laser 2 p 40 10 12 C c tone + () 80 10 3 ------------------------------------------------------------------------------------------------- hz [] = t zero 40 10 12 C c tzero + () 50 10 3 h laser --------------------- - = s [] b zero 1 2 pt zero ---------------------------- = hz [] b zero h laser 2 p 40 10 12 C c tzero + () 50 10 3 --------------------------------------------------------------------------------------------------- - hz [] =
2000 feb 22 9 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u in this example, the resulting bandwidth for the optical 1 modulation current control loop, without an external capacitor, is: the resulting bandwidth for the optical 0 bias current control loop, without an external capacitor, is: it is not necessary to add additional capacitance with this type of laser. control loop data pattern and bit rate dependency the constants in equations (1) and (3) are valid when the data pattern frequently contains a sufficient number of constant zeroes and constant ones. a single control loop time period ( t one and t zero ) must contain ones and zeros for at least approximately 6 ns (as provided, for example, by the a1/a2 frame alignment bytes for stm4/oc12). in practice, the optical extinction ratio increases if the bit rate increases. therefore, it is important to use the actual data patterns and bit rate of the final application circuit for adjusting the optical levels. the laser driver peak detectors are able to track mpd output current overshoot and undershoot conditions. unfortunately, these conditions affect the ability of the ic to correctly interpret the high and low level mpd current. in particular, the occurrence of undershoot can have a markedly adverse effect on the interpretation of the low level mpd current. additional bias by modulation off current although during operation, the full modulation current switches between outputs la and laq, a small amount of modulation current continues to flow through the inactive pin. for example, when the laser, whose cathode is connected to la, is in the dark part of its operating cycle (logic 0), some of the modulation off current flows through la while most of the current flows through laq. this value i o(mod)(off) is effectively added to the bias current and is subtracted from the modulation current. fortunately, the value correlates closely with the magnitude of the modulation current. therefore, applications requiring low bias and low modulation are less affected. figure 9 shows the modulation off current as a function of the modulation on current. monitoring the bias and modulation current although not recommended, the bias and modulation currents generated by the laser driver can be monitored by measuring the voltages on pins tzero and tone, respectively (see fig.10). the relationship between these voltages and the corresponding currents are given as transconductance values and are specified in chapter characteristics. the voltages on pins tzero and tone range from 1.4 to 3.4 v. any connection to these pins should have a very high impedance value. it is mandatory to use a cmos buffer or an amplifier with an input impedance higher than 100 g w and with an extremely low input leakage current (pa). b one 30 10 3 C 500 10 3 C 2 p 40 10 12 C 80 10 3 -------------------------------------------------------------------- - 750 hz ? = b zero 0.5 30 10 3 C 500 10 3 C 2 p 40 10 12 C 50 10 3 ------------------------------------------------------------------------- 600 hz ? = handbook, halfpage 0 204060 3 1 0 2 mgs902 i o(mod)(on) (ma) (2) (1) i o(mod)(off) (ma) fig.9 i o(mod)(off) as a function of i o(mod)(on) . (1) worst case operation (t j = 125 c, v cc = 5.5 v and worst case parameter processes). (2) typical operation.
2000 feb 22 10 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u automatic laser shut-down and laser slow start the laser modulation and bias currents can be rapidly switched off when a high level (cmos) is applied to pin als. this function allows the circuit to be shut-down in the event of an optical system malfunction. a 25 k w pull-down resistor defaults pin als to the non active state (see fig.11). when a low level is applied to pin als, the modulation and bias currents slowly increase to the desired values at the typical time constants of t one and t zero , respectively. this can be used to slow-start the laser. manual laser override the automatic laser control function can be overridden by connecting voltage sources to pins tzero and tone to take direct control of the current sources for bias and modulation respectively. the control voltages should range from 1.4 to 3.4 v to swing the modulation current over the range 1 to 60 ma and the bias current over the range 1 to 90 ma. these current ranges are guaranteed. due to the tolerance range in the manufacturing process, some devices may have higher current values than those specified, as shown in figs 12 and 13. both figures show that temperature changes cause a slight tilting of the linear characteristic around an input voltage of 2.4 v. consequently, the manually controlled current level is most insensitive to temperature variations at around this value. bias and modulation currents in excess of the specified range are not supported and should be avoided. currents into or out of pins tzero and tone in excess of 10 m a must be avoided to prevent damage to the circuit. handbook, halfpage mgs905 gnd 40 pf < 1 na linear voltage to current converter tzero, tone 2.4 v < 1 na fig.10 tzero and tone internal configuration. handbook, halfpage mgs911 25 k w v cc(r) 100 w gnd als 100 w fig.11 als input.
2000 feb 22 11 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth 3.9 160 120 40 0 1.4 1.9 3.4 80 2.9 2.4 mgs904 i o(mod) (ma) v tone (v) (3) (4) (1) (5) specified range (2) fig.12 modulation current with variation in t j and tolerance range in the manufacturing process. (1) t j =25 c (device with characteristics at upper limit of manufacturing tolerance range). (2) t j =25 c (typical device). (3) t j = - 40 c (typical device). (4) t j = 125 c (typical device). (5) t j =25 c (device with characteristics at lower limit of manufacturing tolerance range).
2000 feb 22 12 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth 3.9 160 120 40 0 1.4 1.9 3.4 80 2.9 2.4 mgs903 i o(bias) (ma) v tzero (v) (2) (3) (4) (5) (1) specified range fig.13 bias current with variation in t j and tolerance range in the manufacturing process. (1) t j =25 c (device with characteristics at upper limit of manufacturing tolerance range). (2) t j =25 c (typical device). (3) t j = - 40 c (typical device). (4) t j = 125 c (typical device). (5) t j =25 c (device with characteristics at lower limit of manufacturing tolerance range).
2000 feb 22 13 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u bias alarm for tza3001ahl the bias current alarm circuit detects whenever the bias current is outside a predefined range, and generates a flag. this feature can detect excessive bias current due to laser ageing or laser malfunctioning. the current applied to pin alarmhi should be the maximum permitted bias current value attenuated by a ratio of 1:1500. the current applied to pin alarmlo should be the minimum permitted bias current value attenuated by a ratio of 1:300. like the reference currents for the laser current control loop, the alarm reference currents can be set by connecting external resistors between v cc(r) and pins alarmhi and alarmlo (see fig.8). the resistor values can be calculated using the following formulae: (9) (10) example: the following reference currents are required to limit the bias current range from 6 to 90 ma: and the corresponding resistor values are: and if the alarm condition is true, the voltage on pin alarm (see fig.14) goes to a high level (cmos). this signal could be used, for example, to drive pin als to disable the laser driver; the signal to pin als has to be latched to prevent oscillation. a hysteresis of approximately 10% is applied to both alarm functions. the attenuation ratios of 1:300 and 1:1500 are valid if the bias current rises above the reference current levels. if the bias current decreases, the ratios are 10% lower. accuracy of voltage on inputs: one, zero, alarmlo, alarmhi it is important to consider the accuracy of the 1.5 v level with respect to v cc(r) on pins one and zero if resistors are used to set the reference currents. although this value is independent of v cc(r) , deviations from 1.5 v can be caused by: input current: at t j =25 c, the voltage between pin and v cc varies from 1.58 v at an input current of 6 m a, down to 1.45 v at 65 m a and 1.41 v at 100 m a. the range between 65 m a and 100 m a is only specified for alarmlo. in the application, the input current is virtually fixed, so this variation has little effect. variation in batch and individual device characteristics, not exceeding 2% from the nominal product: this variation can be compensated for where devices in the application are individually trimmed. temperature: the variation in t j is shown in fig.15. at 30 m a (middle of the specified range) the total variation in t j is <1%, at 65 m a it is <2% and at 6 m aitis <3%. r alarmhi 1.5 1500 i obias () max () --------------------------------- = w [] r alarmlo 1.5 300 i o bias () min () -------------------------------- = w [] i alarmlo 610 3 C 300 -------------------- - 20 m a == i alarmhi 90 10 3 C 1500 ------------------------ 60 m a == r alarmhi 1.5 1500 90 10 3 C --------------------------- - 25 k w == r alarmlo 1.5 300 610 3 C ------------------------ 75 k w == handbook, halfpage mgs909 20 w 43 w v cc(r) gnd alarm fig.14 alarm output.
2000 feb 22 14 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth 150 - 1.65 - 1.55 - 1.45 - 1.60 - 1.50 - 1.40 - 1.35 - 50 - 40 125 0 100 50 mgs901 v ref (1) (v) t j ( c) (2) (3) (4) (3) (4) (2) (3) (4) i ref = 6 m a i ref = 30 m a i ref = 65 m a (2) fig.15 v ref on pins one, zero, alarmlo and alarmhi with variation in t j and i ref . (1) referenced to v cc(r) . (2) upper limit of manufacturing tolerance range. (3) nominal product. (4) lower limit of manufacturing tolerance range.
2000 feb 22 15 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u loop mode for tza3001bhl the loop mode allows the total system application to be tested. it allows for uninhibited optical transmission through the fibre front-end (from the mpd through the transimpedance stage and the data and clock recovery unit, to the laser driver and via the laser back to the fibre). note that the optical receiver used in conjunction with the tza3001bhl must have a loop mode output in order to complete the test loop. the loop mode is selected by a high level on pin enl. by default, pin enl is pulled to a low level by a 25 k w pull-down resistor (see fig.16). power supply connections refer to application diagrams figs 18 and 19. three separate supply domains (labelled v cc(g) , v cc(b) , and v cc(r) ) provide isolation between the mpd current input, the high-current outputs, and the pecl or cml inputs. each supply domain should be connected to a central v cc via separate filters as shown in figs 18 and 19. all supply pins must be connected . the voltage supply levels should be equal to, and in accordance with, the values specified in chapter characteristics. to maximize power supply isolation, the cathode of the mpd should be connected to v cc(g) and the anode of the laser diode should be connected to v cc(b) . it is recommended that the laser diode anode is also connected to a separate decoupling capacitor c9. generally, the inverted laser modulation output (pin laq) is not used. to correctly balance the output stage, an equalization network (z1) with an impedance comparable to the laser diode is connected between pin laq and v cc(b) . all external components should be surface mounted devices, preferably of size 0603 or smaller. the components must be mounted as close to the ic as possible. it is especially recommended to mount the following components very close to the ic: power supply decoupling capacitors c2, c3 and c4 input matching network on pins din, dinq, dloop and dloopq capacitor c5 on pin monin output matching network z1 at the unused output the laser. bare die ground in addition to the separate v cc domains, the bare die contains three corresponding ground (gnd) domains. isolation between the gnd domains is limited due to the finite substrate conductance. mount the die preferably on a large and highly conductive grounded die pad. all gnd pads must be bonded to the die pad. the external ground is thus ideally combined with the die ground to avoid ground bounce problems. layout recommendations layout recommendations for the tza3001ahl and tza3001bhl can be found in application note an98090 fiber optic transceiverboard stm1/4/8, oc3,12,24, fc/ge . handbook, halfpage mgs912 25 k w v cc(r) gnd enl 600 w fig.16 enl input.
2000 feb 22 16 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u limiting values in accordance with the absolute maximum rating system (iec 60134). thermal characteristics symbol parameter min. max. unit v cc supply voltage - 0.5 +6 v v n dc voltage on pin monin 1.3 v cc + 0.5 v pins tone and tzero - 0.5 v cc + 0.5 v pin bgap - 0.5 +3.2 v pin bias - 0.5 v cc + 0.5 v pins la and laq 1.3 v cc + 0.5 v pin als - 0.5 v cc + 0.5 v pins one and zero - 0.5 v cc + 0.5 v pins din and dinq - 0.5 v cc + 0.5 v pin alarm (tza3001ahl) - 0.5 v cc + 0.5 v pins alarmhi and alarmlo (tza3001ahl) - 0.5 v cc + 0.5 v pins dloop and dloopq (tza3001bhl) - 0.5 v cc + 0.5 v pin enl (tza3001bhl) - 0.5 v cc + 0.5 v i n dc current on pin monin - 0.5 +2.5 ma pins tone and tzero - 0.5 +0.5 ma pin bgap - 2.0 +2.5 ma pin bias - 0.5 +200 ma pins la and laq - 0.5 +100 ma pin als - 0.5 +0.5 ma pins one and zero - 0.5 +0.5 ma pins din and dinq - 0.5 +0.5 ma pin alarm (tza3001ahl) - 0.5 +10 ma pins alarmhi and alarmlo (tza3001ahl) - 0.5 +0.5 ma pins dloop and dloopq (tza3001bhl) - 0.5 +0.5 ma pin enl (tza3001bhl) - 0.5 +0.5 ma t amb ambient temperature - 40 +85 c t j junction temperature - 40 +125 c t stg storage temperature - 65 +150 c symbol parameter value unit r th(j-s) thermal resistance from junction to solder point 15 k/w r th(j-c) thermal resistance from junction to case 23 k/w
2000 feb 22 17 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u characteristics v cc = 4.5 to 5.5 v; t amb = - 40 to +85 c; all voltages measured with respect to gnd. symbol parameter conditions min. typ. max. unit supply v cc supply voltage 4.5 5.0 5.5 v i cc(r) supply current (r) - 410 ma i cc(g) supply current (g) 12 18 26 ma i cc(b) supply current (b) als low; note 1 20 41 65 ma als high - 35 ma i cc(tot) total supply current als low; note 1 32 63 101 ma als high 12 25 41 ma p tot total power dissipation als low; note 2 145 430 925 mw als high; note 2 50 125 225 mw data inputs: pins din and dinq (and pins dloop and dloopq on tza3001bhl); (see fig.17) v i(p-p) input voltage (peak-to-peak value) single-ended 100 250 800 mv v io input offset voltage - 25 - +25 mv v i(min) minimum input voltage v cc(r) - 2 -- v v i(max) maximum input voltage -- v cc(r) + 0.25 v z i input impedance for low frequencies; single-ended 71013k w cmos inputs: pin als (and pin enl on tza3001bhl) v il low-level input voltage -- 2v v ih high-level input voltage 3 -- v r pd(als) internal pull-down resistance on pin als 21 25.5 30 k w r pd(enl) internal pull-down resistance on pin enl 15 25 35 k w cmos output: pin alarm (on tza3001ahl) v ol low-level output voltage i oh = - 200 m a0 - 0.2 v v oh high-level output voltage i oh = 200 m av cc - 0.2 - v cc v monitor photodiode input: pin monin v i dc input voltage 1.2 1.8 2.4 v i mpd monitor photodiode current laser optical 0 24 - 260 m a laser optical 1 96 - 1040 m a c mpd monitor photodiode capacitance note 3 30 - 50 pf
2000 feb 22 18 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u control loop reference current inputs: pins one and zero i ref(one) reference current on pin one note 4 6 - 65 m a v ref(one) reference voltage on pin one referenced to v cc(r) ; note 5 -- 1.5 - v a (one) attenuation ratio of i ref(one) to i mpd(one) note 6 - 16 -- i ref(zero) reference current on pin zero note 4 6 - 65 m a v ref(zero) reference voltage on pin zero referenced to v cc(r) ; note 5 -- 1.5 - v a (zero) attenuation ratio of i ref(zero) to i mpd(zero) note 6 - 4 -- control loop time constants: pins tone and tzero v tone voltage on pin tone ?oating output 1.4 - 3.4 v g m(tone) transconductance of pin tone note 7 60 95 130 ma/v v tzero voltage on pin tzero ?oating output 1.4 - 3.4 v g m(tzero) transconductance of pin tzero note 8 100 145 190 ma/v laser modulation current outputs: pins la and laq i o(mod)(on) modulation output current (active pin) note 9 2.5 - 60 ma i o(mod)(off) modulation output current (inactive pin) i o(mod)(on) = 30ma -- 0.5 ma i o(mod)(on) = 60ma -- 2.8 ma i o(mod)(als) output current during laser shutdown -- 10 m a v o output voltage 2 - 5v t r current rise time note 10 - 120 300 ps t f current fall time note 10 - 120 300 ps j o(p-p) intrinsic electrical output jitter (peak-to-peak value) note 11 -- 50 mui laser bias current output: pin bias i o(bias) bias output current note 12 2.8 - 90 ma i o(bias)(als) output current during laser shutdown -- 10 m a t res(off) response time after laser shutdown i o(bias) = 90 ma; note 13 -- 1 m s v o(bias) bias output voltage 1 - 5v symbol parameter conditions min. typ. max. unit
2000 feb 22 19 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u notes 1. supply current: a) the values do not include the modulation and bias currents through pins la, laq and bias. b) minimum value refers to v tone = 1.4 v at i o(mod)(min) and v tzero = 1.4 v at i o(bias)(min) . c) maximum value refers to v tone = 3.4 v at i o(mod)(max) and v tzero = 3.4 v at i o(bias)(max) . d) a first order estimate of the typical value of i cc(tot) as a function of t j , i o(mod) , and i o(bias) is: i cc(tot) = . 2. power dissipation: a) the value for p tot includes the modulation and bias currents through pins la, laq and bias. b) the minimum value for p tot is the on-chip dissipation when v tone = 1.4 v at i o(mod)(min) , v la =v laq =2v, v tzero = 1.4 v at i o(bias)(min) , v o(bias) = 1 v, and parameter processes are at a minimum. c) the maximum value for p tot is the on-chip dissipation when v tone = 3.4 v at i o(mod)(max) , v la =v laq =2v, v tzero = 3.4 v at i o(bias)(max) , v o(bias) = 1 v, and parameter processes are at a maximum. d) p tot =i cc(tot) v cc +i o(bias) v o(bias) +i la v la with i o(mod)(on) flowing through pin la. 3. the minimum value of the capacitance on pin monin is required to prevent instability. 4. the reference currents can be set by connecting external resistors between v cc and pins one and zero (see section automatic laser control). the corresponding mpd current range for optical 1 is from 96 to 1040 m a. the mpd current range for optical 0 is from 24 to 260 m a. 5. see section accuracy of voltage on inputs: one, zero, alarmlo, alarmhi. 6. see section automatic laser control. 7. the specified transconductance is the ratio between the modulation current on pins la or laq and the voltage on pin tone, under small signal conditions. alarm reference current inputs: pins alarmhi and alarmlo (tza3001ahl) i ref(alarmlo) reference current on pin alarmlo note 14 6 - 100 m a v ref(alarmlo) reference voltage on pin alarmlo referenced to v cc(r) -- 1.5 - v a (alarmlo) attenuation ratio of i ref(alarmlo) to i o(bias)(min) note 15 200 315 400 i o(bias)(min)(hys) minimum bias current detection hysteresis 7.5 10 15 % i ref(alarmhi) reference current on pin alarmhi note 14 6 - 65 m a v ref(alarmhi) reference voltage on pin alarmhi referenced to v cc(r) -- 1.5 - v a (alarmhi) attenuation ratio of i ref(alarmhi) to i o(bias)(max) note 15 1300 1500 1700 i o(bias)(max)(hys) maximum bias current detection hysteresis 7.5 10 15 % reference voltage output: pin bgap v o output voltage 1.165 1.20 1.235 m a symbol parameter conditions min. typ. max. unit 55.6 ma 0.0015 + i obias () ma [] i o mod () on () ma [] 1 0.026 t j c [] 25 ---------------- - C ? ? ?
2000 feb 22 20 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u 8. the specified transconductance is the ratio between the bias current on pin bias and the voltage on pin tzero, under small signal conditions. 9. these are the guaranteed values; the lowest attainable output current will always be lower than 2.5 ma, and the highest output current will always be higher than 60 ma. 10. the voltage rise and fall times (20% to 80%) can have larger values due to capacitive effects. specifications are guaranteed by design and characterization. each device is tested at full operating speed to guarantee rf functionality. 11. measured in a frequency band from 250 khz to 5 mhz, according to itu-t recommendation g.813 . the electrically generated (current) jitter is assumed to be less than 50% of the optical output jitter. the specification is guaranteed by design. 12. these are the guaranteed values; the lowest output current will always be less than 2.8 ma and the highest output current will always be more than 90 ma. 13. the response time is defined as the delay between the onset of the ramp on pin als (at 10% of the high-level) and the extinction of the bias current (at 10% of the original value). 14. the reference currents can be set by connecting a resistor between pin alarmlo and v cc(r) and between pin alarmhi and v cc(r) ; for detailed information, see section bias alarm for tza3001ahl. the corresponding low-bias threshold range is 1.8 to 19.5 ma. the high-bias threshold range is 9 to 97.5 ma. 15. see section bias alarm for tza3001ahl. handbook, full pagewidth mgk274 v io v i(max) v i(min) v i(p-p) v cc(r) fig.17 logic level symbol definitions for data inputs.
2000 feb 22 21 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u application information handbook, full pagewidth mgk276 r5 18 w tza3001ahl v cc(r) tone monin 11 c6 (3) tzero c7 (4) bgap 22 nf c8 2 4 5 6 1, 3, 8, 9, 11, 14, 16, 17, 24, 25, 32 15 13 12 gnd bias la laq 19, 20, 27, 30 v cc(b) v cc(g) als 31 710 dinq 29 din 28 alarm r1 (5) r2 (5) r3 (6) r4 (6) 26 23 22 data inputs normal mode (cml/pecl compatible) 21 18 alarmhi laser c9 mpd alarmlo z1 (7) c5 (2) l1 4 one zero c2 22 nf v cc c1 1 m f c3 22 nf c4 22 nf (1) (1) (1) fig.18 application diagram showing the tza3001ahl configured for 622 mbits/s (stm4/oc12). (1) ferrite bead e.g. murata blm31a601s. (2) c5 is required to meet the minimum capacitance value on pin monin (optional, see section automatic laser control). (3) c6 enhances modulation control loop time constant (optional). (4) c7 enhances bias control loop time constant (optional). (5) r1 and r2 are used for setting optical 0 and optical 1 reference currents (see section automatic laser control). (6) r3 and r4 are used for setting minimum and maximum bias currents (see section bias alarm for tza3001ahl). (7) z1 is required for balancing the output stage (see section power supply connections).
2000 feb 22 22 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth mgk275 r3 18 w tza3001bhl v cc(r) tone monin 11 c6 (3) tzero c7 (4) bgap 22 nf c8 2 4 5 6 1, 3, 8, 9, 11, 14, 16, 17, 24, 25, 32 15 13 12 gnd bias la laq 18, 21, 27, 30 v cc(b) v cc(g) als 31 710 dinq 29 din 28 enl r1 (5) r2 (5) 26 23 22 data inputs normal mode (cml/pecl compatible) 20 19 laser c9 mpd z1 (6) c5 (2) l1 4 one zero c2 22 nf (1) v cc c1 1 m f c3 22 nf c4 22 nf loop mode inputs (cml/pecl compatible) dloop dloopq (1) (1) fig.19 application diagram showing the tza3001bhl configured for 622 mbits/s (stm4/oc12). (1) ferrite bead e.g. murata blm31a601s. (2) c5 is required to meet the minimum capacitance value on pin monin (optional, see section automatic laser control). (3) c6 enhances modulation control loop time constant (optional). (4) c7 enhances bias control loop time constant (optional). (5) r1 and r2 are used for setting optical 0 and optical 1 reference currents (see section automatic laser control). (6) z1 is required for balancing the output stage (see section power supply connections).
2000 feb 22 23 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u bonding pad locations note 1. all x and y coordinates represent the position of the centre of the pad in m m with respect to the centre of the die (see fig.20). symbol pad coordinates (1) xy gnd 1 - 664 - 910 monin 2 - 524 - 910 gnd 3 - 367 - 910 igm 4 - 227 - 910 tone 5 - 70 - 910 tzero 6 +87 - 910 bgap 7 +244 - 910 v cc(g) 8 +384 - 910 v cc(g) 9 +524 - 910 gnd 10 +664 - 910 gnd 11 +910 - 630 v cc(b) 12 +910 - 490 v cc(b) 13 +910 - 350 gnd 14 +910 - 210 laq 15 +910 - 70 la 16 +910 +70 gnd 17 +910 +210 bias 18 +910 +350 gnd 19 +910 +490 gnd 20 +910 +630 gnd 21 +681 +910 alarmhi 22 +541 +910 v cc(r) 23 +384 +910 dloop 24 +227 +910 dloopq 25 +87 +910 v cc(r) 26 - 70 +910 alarmlo 27 - 210 +910 one 28 - 367 +910 zero 29 - 524 +910 gnd 30 - 681 +910 gnd 31 - 910 +681 alarm 32 - 910 +541 enl 33 - 910 +384 v cc(r) 34 - 910 +227 din 35 - 910 +70 dinq 36 - 910 - 70 v cc(r) 37 - 910 - 227 als 38 - 910 - 367 gnd 39 - 910 - 551 gnd 40 - 910 - 664 symbol pad coordinates (1) xy
2000 feb 22 24 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u handbook, full pagewidth mgl192 y 2 mm (1) x 0 0 tza3001u 1 2 3 4 5 10 9 8 7 6 30 29 28 27 26 21 2 mm (1) 22 23 24 25 35 36 37 38 40 39 31 32 33 34 16 15 14 13 11 12 20 19 18 17 tone igm gnd monin gnd gnd v cc(g) v cc(g) bgap tzero alarmlo zero gnd one laq v cc(b) v cc(b) gnd als gnd gnd la gnd bias gnd gnd gnd enl alarm gnd v cc(r) dinq din v cc(r) gnd alarmhi v cc(r) dloop dloopq v cc(r) fig.20 bonding pad locations of tza3001u. (1) typical value. table 1 physical characteristics of bare die parameter value glass passivation 2.1 m m psg (phosphosilicate glass) on top of 0.7 m m silicon nitride bonding pad dimension minimum dimension of exposed metallization is 90 90 m m (pad size = 100 100 m m) metallization 1.2 m m alcu (1% cu) thickness 380 m m nominal size 2.000 2.000 mm (4.000 mm 2 ) backing silicon; electrically connected to gnd potential through substrate contacts attach temperature <430 c; glue is recommended for attaching die attach time <15 s
2000 feb 22 25 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u package outline 0.2 unit a max. a 1 a 2 a 3 b p ce (1) eh e ll p z y w v q references outline version european projection issue date iec jedec eiaj mm 1.60 0.15 0.05 1.5 1.3 0.25 0.27 0.17 0.18 0.12 5.1 4.9 0.5 7.15 6.85 1.0 0.95 0.55 7 0 o o 0.12 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.75 0.45 sot401-1 136e01 ms-026 99-12-27 00-01-19 d (1) (1) (1) 5.1 4.9 h d 7.15 6.85 e z 0.95 0.55 d b p e e b 8 d h b p e h v m b d z d a z e e v m a x 1 32 25 24 17 16 9 q a 1 a l p detail x l (a ) 3 a 2 y w m w m 0 2.5 5 mm scale lqfp32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm sot401-1 c pin 1 index
2000 feb 22 26 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u soldering introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering is not always suitable for surface mount ics, or for printed-circuit boards with high population densities. in these situations reflow soldering is often used. re?ow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 250 c. the top-surface temperature of the packages should preferable be kept below 230 c. wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2000 feb 22 27 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u suitability of surface mount ic packages for wave and re?ow soldering methods notes 1. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 2. these packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 4. wave soldering is only suitable for lqfp, tqfp and qfp packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. wave soldering is only suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package soldering method wave reflow (1) bga, lfbga, sqfp, tfbga not suitable suitable hlqfp, hsqfp, hsop, htqfp, htssop, sms not suitable (2) suitable plcc (3) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (3)(4) suitable ssop, tssop, vso not recommended (5) suitable
2000 feb 22 28 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. bare die disclaimer all die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of philips' delivery. if there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post packing tests performed on individual die or wafer. philips semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, philips semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
2000 feb 22 29 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u notes
2000 feb 22 30 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u notes
2000 feb 22 31 philips semiconductors product speci?cation sdh/sonet stm4/oc12 laser drivers tza3001ahl; tza3001bhl; tza3001u notes
? philips electronics n.v. sca all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. internet: http://www.semiconductors.philips.com 2000 69 philips semiconductors C a worldwide company for all other countries apply to: philips semiconductors, international marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 3 figtree drive, homebush, nsw 2140, tel. +61 2 9704 8141, fax. +61 2 9704 8139 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101 1248, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 20 0733, fax. +375 172 20 0773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 68 9211, fax. +359 2 68 9102 canada: philips semiconductors/components, tel. +1 800 234 7381, fax. +1 800 943 0087 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: sydhavnsgade 23, 1780 copenhagen v, tel. +45 33 29 3333, fax. +45 33 29 3905 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615 800, fax. +358 9 6158 0920 france: 51 rue carnot, bp317, 92156 suresnes cedex, tel. +33 1 4099 6161, fax. +33 1 4099 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 2353 60, fax. +49 40 2353 6300 hungary: see austria india: philips india ltd, band box building, 2nd floor, 254-d, dr. annie besant road, worli, mumbai 400 025, tel. +91 22 493 8541, fax. +91 22 493 0966 indonesia: pt philips development corporation, semiconductors division, gedung philips, jl. buncit raya kav.99-100, jakarta 12510, tel. +62 21 794 0040 ext. 2501, fax. +62 21 794 0080 ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, po box 18053, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, via casati, 23 - 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go to philips semiconductors' home page select & go... start part catalog & datasheets catalog by function discrete semiconductors audio clocks and watches data communications microcontrollers peripherals standard analog video wired communications wireless communications catalog by system automotive consumer multimedia systems communications pc/pc-peripherals cross reference models packages application notes selection guides other technical documentation end of life information datahandbook system relevant links about catalog tree about search about this site subscribe to enews catalog & datasheets search tza3001ahl; tza3001bhl; tza3001u tza3001ahl; tza3001bhl; tza3001u information as of 2000 - 08 - 20 tza3001ahl; tza3001bhl; tza3001u; sdh/sonet stm4/oc12 laser drivers the tza3001ahl, tza3001bhl and tza3001u are fully integrated laser drivers for stm4/oc12 (622 mbits/s) systems, incorporating the rf path between the data multiplexer and the laser diode. since the dual loop bias and modulation control circuits are integrated on the ic, the external component count is low. only decoupling capacitors and adjustment resistors are required. the tza3001ahl features an alarm function for signalling extreme bias current conditions. the alarm low and high threshold levels can be adjusted to suit the application using only a resistor or a current digital-to-analog converter (dac). the tza3001bhl is provided with an additional rf data input to allow remote system testing (loop mode). the tza3001u is a bare die version for use in compact laser module designs. the die contains 40 pads and features the combined functionality of the tza3001ahl and the tza3001bhl. l 622 mbits/s data input, both current mode logic (cml) and positive emitter coupled logic (pecl) compatible; maximum 800 mv (p-p) l adaptive laser output control with dual loop, stabilizing optical 1 and 0 levels l optional external control of laser modulation and biasing currents (non-adaptive) l automatic laser shutdown l few external components required l rise and fall times of 120 ps (typical value) l jitter p50 mui (p-p) l rf output current sinking capability of 60 ma l bias current sinking capability of 90 ma l power dissipation of 430 mw (typical value) l low cost lqfp32 5 x 5 plastic package ? description ? features ? applications ? datasheet ? products, packages, availability and ordering ? find similar products to be kept informed on tza3001ahl; tza3001bhl; tza3001u, subscribe to enews. subscribe to enews description features
l single 5 v power supply. tza3001ahl l laser alarm output for signalling extremely low and high bias current conditions. tza3001bhl ? extra stm4 622 mbits/s loop mode input; both cml and pecl compatible. tza3001u ? bare die version with combined bias alarm and loop mode functionality. ? sdh/sonet stm4/oc12 optical transmission systems ? sdh/sonet stm4/oc12 optical laser modules. applications datasheet type nr. title publication release date datasheet status page count file size (kb) datasheet tza3001ahl; tza3001bhl; tza3001u sdh/sonet stm4/oc12 laser drivers 22-feb-00 product specification 32 137 download products, packages, availability and ordering partnumber north american partnumber order code (12nc) marking/packing package device status buy online tza3001ahl/c4 9352 638 39118 standard marking * reel pack, smd, 13" sot401 full production - tza3001bhl/c1 9352 603 71551 standard marking * tray dry pack, bakeable, single sot401 development - tza3001bhl/c4 9352 638 34118 standard marking * reel pack, smd, 13" sot401 full production - tza3001u/c4 9352 638 40026 no marking * die in waffle carriers none full production -
please read information about some discontinued variants of this product . tza3001ahl; tza3001bhl; tza3001u links to the similar products page containing an overview of products that are similar in function or related to the part number(s) as listed on this page. the similar products page includes products from the same catalog tree(s) , relevant selection guides and products from the same functional category. find similar products: copyright ? 2000 royal philips electronics all rights reserved. terms and conditions .

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